Sunday, June 08, 2008

[itsdifferent] Chips stack up in third dimension

Stacks of chips, one on top of the other, will power the next generation of superfast PCs, IBM has announced. Laying chips vertically, instead of side by side, reduces the distance data has to travel by 1,000 times, making the chips faster and more efficient.

Check out my blog for more details.

Regards,
Sudev Gandhi

Recent Articles On My Blog

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